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Suggestions for the bonding of 4EC Series IC
TIME: 2007-10-29
 
Currently some users found that a numbers of PWM circuits are damaged and short-circutes occurred in PWM2 when bonding 4EC series IC. For those problem, we observed the bondings by microscope. Then learned that the damages were caused during bonding. Herein we’d like to introduce some suggestions for bonding VDD1 and PWM1 as following:
 
1.The line of PWM2(left) is quite close to VDD1 Pad. Therefore, when bonding, note that the welding points are not too left, otherwise will cause short-circuit between VDD1 and PWM2.

2.Since there are lines of PWM near to the left and right sides of PWM1, they may be damaged easily if bonding. Consider that set the lines in vertical direction when designing bonding.
 
ORIGIN: R.vigro
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ICP Record : 08035793 Prepared Guangdong ICP